Used during the chemical-mechanical-planarization (CMP) of semiconductor wafers, this automated metrology tool orchestrates patented laser particle-sensing techniques, powerful algorithms and multicore image processing to analyze production strength slurry with real-time measurements.
The SlurryScope System instantly detects and profiles oversized particles in the 1.0-10.0 micron ranges that can cause damaging micro-scratches to wafers. The SlurryScope System can be used for on-site beta testing of multiple slurry types, correlating to previous dilution tests of slurry samples (Silica and Alumina). For low particle count Cu and W slurries, a high-resolution sensor is available for the particle size range 0.8-4.0 microns.
Undiluted ceria and colloidal-silica slurries have been measured by multiple customers on slurry delivery lines with more than 200 hours of continuous monitoring. All slurries were measured in real-time with time-stamped results sent to a customer database.
The SlurryScope System detects large particles in the slurry that can micro-scratch wafers, thereby impairing quality and yield during the CMP processing. Also characterizing overall particle distribution being delivered to each wafer, this versatile tool offers the following benefits
- Identify and measure Large Particle Count (LPC) real-time in CMP slurry to prevent wafer defects and scratching
- · Compare distribution of particles by size, slurry type and condition to improve process results
- · Correlate wafer results by continuous undiluted slurry examination during CMP processing
- · Reduce CMP costs by extending both slurry and filter life cycles
- · Increase slurry utilization and reduce costs by continuously monitoring slurry during CMP processing
- · Eliminates need for dilution (a technique currently used to "see through" the slurry) and its associated errors and waste
Slurry blend preparation, including raw materials:
o Raw Slurry – Identify suspension issues (inhomogeneous mixing,solids distribution, settling in tote/drum)
o Batch Blending – Batch-to-batch LPC performance
o Local Circulation Loop – Verify LPC count during batch qualification
o Side Switching - Batch-to-batch LPC verification and trending
o Global Loop Supply – Verify LPC prior to VMB
Filtration LPC issues, operation and maintenance
o Filter – Detect element end of life and/or breakthrough
o Maintenance – Detect LPC excursions from filter shockConfiguration for monitoring filter operation/maintenance...
Monitoring effects of filtration... (hyperlink to existing material)
CMP Point of Use (POU) slurry LPC to wafer CMP performance correlation
o Global Loop Return – Detect loop-generated LPC
o Point of Use – Correlate wafer-to-wafer CMP results with slurry LPC
Configuration to correlate LPC to wafer CMP results... (hyperlink to existing material)